Table of Contents
Introduction
• Importance of automotive electronics and industrial control as Fuzetec’s top markets• EV transition to 48V systems and demand for 240–305Vac charging infrastructure
• Industry 4.0 automation, AI, and the need for high-frequency semiconductor switching
Power Semiconductors Overview
Role of Power Semiconductors
• Core function in power conversion, energy management, motor control• High-voltage, high-current switching with efficiency optimization
Major Categories of Power Semiconductors
• Diodes – rectification (AC to DC)• Transistors – high-power AC control
• MOSFET – low-voltage, high-frequency switching
• IGBT – high-voltage, high-power efficiency
• Wide Bandgap (GaN / SiC) – high-efficiency power conversion, EV charging, 5G base stations
Everyday Analogy for Understanding
• MOSFET as faucet switch (low-voltage control)• Diode as check valve (direction control)
• IGBT as dam gate (large current control at high voltage)
Wide Bandgap Semiconductors – GaN and SiC
Material Characteristics
• SiC: 1000V–1200V, high thermal conductivity, high cost, suitable for high-voltage EV/renewable• GaN: 80V–650V (expanding toward 800V), lower cost, ideal for consumer fast charging and mid-voltage markets
Market Applications
• SiC – EV systems, solar inverters, wind converters, 5G base stations• GaN – smartphones, laptops (fast charging), data centers, industrial equipment, EV OBC/DC-AC converters
Industry Developments
• Tesla adoption and reduced SiC content, shifting spotlight to GaN• PI’s launch of 750V–900V GaN solutions for unstable power regions and automotive use
• Forecast: GaN to capture sub-650V MOSFET market from 2025 onward
Fuzetec’s Technological Breakthroughs and Market Strategy
AC Voltage Series
• First-to-market DIP FRV 277Vac & 305Vac, SMD 240Vac• Achieved international safety certifications
• Roadmap: 380Vac / 440Vac development
• Applications: EV charging, industrial automation, renewable energy, rail systems
High-Temperature Series
• DIP & SMD products from –40°C to 125°C• Applications: automotive ECUs, semiconductor modules, 5G base stations, thermal modules
Hybrid Protection Components
• OCP + OVP integration: PPTC + MOV, PPTC + TVS, PPTC + MOSFET• Function: strengthen semiconductor protection, extend lifetime, mitigate electrical surge failures
• Applications: EV systems, mid-/low-voltage industrial modules, charging stations, PLC I/O control
Market Outlook and Strategic Adjustments
Growth Drivers
• Digital transformation fueling semiconductor adoption• AI, IoT, and blockchain driving higher power efficiency demands
• Wide bandgap adoption reshaping automotive, renewable, and industrial sectors
Fuzetec’s Future Roadmap
• Positioning power semiconductors as core solutions in automotive/industrial• Leveraging protection component expertise to develop hybrid solutions
• Strategy: proactive R&D and global certifications for long-term competitiveness
Conclusion
• Fuzetec as a pioneer in protection components expanding into power semiconductors• Integration of wide bandgap technologies (GaN / SiC) for high-performance markets
• Delivering stable, efficient, and reliable solutions for EV, industrial automation, and 5G
• Fuzetec’s commitment to innovation ensures customer-centric, next-generation semiconductor solutions
Discover how Fuzetec’s MOSFET, GaN, and SiC solutions can enhance your automotive and industrial designs. Contact us for technical consultation and product samples.
